Профессиональное производство — от однослойных плат до 32 слоёв. Полные спецификации для PCB, FPC и SMT.
Мгновенный расчётПаяльная маска: Зелёный
| Параметр | Возможности | Примечание |
|---|---|---|
| Base Material | FR-4 / Aluminum / Copper / High-Frequency / FPC | FR-4 is standard; aluminum/copper for thermal management; Rogers/PTFE for RF applications |
| Layer Count | 1 — 32 Layers | Standard: 2/4/6/8L. 8+ layers use HDI or lamination; contact us for 32L+ |
| Max Board Size | 600 × 900 mm | Oversized boards may affect yield and pricing — confirm in advance |
| Min Board Size | 5 × 5 mm | Very small boards recommended to be panelized |
| Board Thickness | 0.1 — 6.0 mm | Standard: 0.8mm 1.0mm 1.2mm 1.6mm 2.0mm |
| Thickness Tolerance | ± 0.10 mm (≤1.6mm) ± 10% (>1.6mm) | High-precision boards can specify ± 0.08mm tolerance |
| Bow & Twist | ≤ 0.75% | High-density BGA boards require ≤ 0.5%; SMT assembly boards recommended ≤ 0.5% |
| Параметр | Возможности | Примечание |
|---|---|---|
| Outer Layer Copper | 0.5 oz — 6 oz | Standard: 1 oz (35μm). High-current designs: 2–4 oz; 6 oz requires evaluation |
| Inner Layer Copper | 0.5 oz — 4 oz | Standard: 1 oz (35μm). Affects impedance calculations |
| Min Trace Width | 2 mil (0.05mm) | Recommended: 4 mil. 2–3 mil is precision process requiring confirmation |
| Min Trace Spacing | 2 mil (0.05mm) | Recommended: 4 mil. Smaller spacing reduces yield |
| Trace Width Tolerance | ± 20% (≥ 5mil) ± 15% (< 5mil) | Impedance-controlled traces must specify target impedance in Gerber files |
| Impedance Control | ± 10% | Differential impedance (100Ω typical) and single-ended (50Ω typical) supported; stackup required |
| Параметр | Возможности | Примечание |
|---|---|---|
| Min Mechanical Drill | 0.20 mm | Recommended: 0.30mm. 0.2mm is precision drilling at higher cost |
| Min Laser Via (HDI) | 0.10 mm | For blind/buried via designs — common in smartphones and high-density products |
| Drill Accuracy | ± 0.05 mm | High-precision hole placement: ± 0.03mm available |
| Hole Tolerance | + 0.08 / − 0.05 mm | PTH finished hole = drill size − plating thickness (approx. 0.04–0.06mm) |
| Max Aspect Ratio | 10 : 1 | For 1.6mm board, recommend via ≥ 0.2mm. HDI can exceed standard limits |
| Blind / Buried Vias | Supported (≥ 4 layers) | HDI 1+N+1 to 2+N+2 structures available |
| Параметр | Возможности | Примечание |
|---|---|---|
| Surface Finish | HASL / Lead-Free HASL / ENIG / OSP / Immersion Silver / Immersion Tin / ENEPIG |
HASL Low cost, good for THT ENIG Flat surface, ideal for BGA/fine-pitch OSP RoHS-friendly for SMT; Immersion Ag/Sn for high-frequency |
| Solder Mask Color | Green / Red / Blue / Yellow / Black / White / Purple | Green is standard with the fastest turnaround; other colors may add 1–2 days |
| Silkscreen Color | White / Black / Yellow | Common pairings: green board + white text; black board + white text |
| Solder Mask Thickness | 10 — 40 μm | Typical: 15–25μm |
| Min Solder Mask Gap | 4 mil (0.1mm) | BGA solder mask opening (NSMD/SMD) must be specified |
| Gold Fingers | Supported | Used for PCIe, DDR interfaces; gold thickness 0.03–3μm |
| Board Profile | CNC Routing / V-Scoring / Laser Cutting | Irregular shapes (round, L-shaped) use CNC routing; V-score for regular rectangular panels |
| Параметр | Возможности | Примечание |
|---|---|---|
| Electrical Test | Flying Probe / Universal Fixture | Fixture testing recommended for production runs (lower cost); flying probe for prototypes (no fixture needed) |
| Test Standard | IPC-A-600 Class 2 / Class 3 | Default Class 2; Class 3 (military/medical) must be declared in advance |
| Certifications | ISO 9001 / ISO 14001 / UL / RoHS | UL certification reports and RoHS compliance declarations available |
| AOI Inspection | 100% Full Inspection | Automated Optical Inspection detects short circuits, open circuits, and solder defects |
| X-Ray Inspection | Supported (BGA applications) | Inspects hidden solder joints under BGA / QFN packages |
| Параметр | Возможности | Примечание |
|---|---|---|
| Layer Count | 1 — 6 Layers | 1L and 2L are most common; 4L+ is for high-density designs |
| Max Board Size | 250 × 500 mm | FPC longer than 500mm should be designed in segments |
| Min Board Size | 5 × 5 mm | — |
| Finished Thickness | 0.1 — 0.5 mm | Standard: 0.1mm (single-layer), 0.2mm (dual-layer) |
| Bend Radius | ≥ 6 × copper thickness | Dynamic bending (repeated flexing) must be declared; special rolled copper required |
| Параметр | Возможности | Примечание |
|---|---|---|
| Copper Weight | 0.5 oz — 2 oz | Standard: 1 oz. Dynamic bending applications: 0.5 oz rolled annealed copper |
| Min Trace / Space | 2 mil / 2 mil (0.05mm) | Recommended: 3 mil. 2 mil is precision FPC requiring special process |
| Min Via Diameter | 0.10mm (laser) 0.20mm (mechanical) | FPC commonly uses laser drilling for blind vias |
| Drill Accuracy | ± 0.05 mm | — |
| Параметр | Возможности | Примечание |
|---|---|---|
| Surface Finish | ENIG / OSP / Immersion Tin | ENIG is the most common choice — excellent solderability and shelf life |
| Coverlay (CVL) | Yellow PI / White PI / Matte Black PI | Coverlay acts as solder mask; yellow PI is standard; white used for backlight/labeling |
| Stiffener | FR-4 / PI / Steel / Aluminum | Required at connector areas to increase insertion strength |
| EMI Shielding | Supported (conductive adhesive film) | Used in signal-sensitive areas (antennas, USB) for EMI shielding |
| Параметр | Возможности | Примечание |
|---|---|---|
| Min Component Size | 0201 (Imperial) / 0.6×0.3mm | Recommended: 0402; 01005 ultra-micro requires special evaluation |
| Max Component Size | 150 × 150 mm | Oversized components may require special placement fixtures |
| Max Component Height | 35 mm | — |
| Placement Accuracy | ± 0.04 mm (Cpk ≥ 1.33) | High-precision equipment suitable for 0.4mm-pitch BGA, QFN, and other fine-pitch components |
| BGA Min Ball Pitch | 0.40 mm | 0.35mm pitch requires special evaluation; X-Ray inspection available post-reflow |
| Daily Capacity | 100,000 points/day | Multiple lines can run in parallel; schedule in advance for large volume orders |
| Параметр | Возможности | Примечание |
|---|---|---|
| Stencil Type | Laser-cut stainless steel | Thickness: 0.08–0.15mm; step stencils available for mixed-pitch designs |
| Solder Paste | Leaded Sn63Pb37 / Lead-Free SAC305 | Lead-free complies with RoHS; leaded for military/special requirements |
| Reflow Oven | 10-zone hot-air reflow | Nitrogen atmosphere reflow available for oxidation-sensitive components |
| Wave Soldering | Supported | For through-hole (DIP) components; mixed boards require secondary soldering |
| Selective Soldering | Supported | For localized through-hole components, avoiding SMD damage during full-board pass |
| Параметр | Возможности | Примечание |
|---|---|---|
| AOI Inspection | 100% Post-Reflow | Detects missing components, polarity reversal, misalignment, and bridging defects |
| X-Ray Inspection | Supported (BGA/QFN) | Detects cold joints and voids under BGA packages; 2D/3D X-Ray available |
| ICT In-Circuit Test | Supported (test points required) | Recommended for high-volume production to verify board electrical function |
| Functional Testing | Supported (customer provides test plan) | Functional verification per customer test plan; test report provided |
| Soldering Standard | IPC-A-610 Class 2 / Class 3 | Default Class 2; Class 3 (military/medical) available upon request |
| Conformal Coating | Supported (acrylic / polyurethane) | Moisture, dust, and corrosion protection for harsh-environment PCBA products |
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